Thermal AI IP camera design
InfraSen is proud to be selected as The Best Innovation Award - Startup Wheel 2020, and to be in the TOP10 Qualcomm Vietnam Innovation Challenge 2022. As part of the challenge, after working closely with Qualcomm engineers, InfraSen confidently provides AI IP camera design for camera manufacturers. The current legacy uncooled thermal imagers are rendered AI-enabled by InfraSen by integration with the Qualcomm connected camera platforms such as QCS605 as well as QCS5430/QCS6490, thanks to the built-in Snapdragon (TM) neural processing engine. The dual visible-thermal or single thermal AI IP camera design service includes, but not limited to, following terms:
☛ Infrared optical design,
☛ Mechanical and electronic design,
☛ Firmware (Linux Android or Embedded Linux) development,
☛ On edge usecase AI model development.
Contact us for a quote sales@infrasen.vn
Current thermal mobile module
Current uncooled thermal imagers are provided with legacy electronics that make it difficult, even impossible, to be integrated with the modern and inevitable mobile platform. Therefore, InfraSen partly enhances legacy thermal imagers in making mobile-enabled thermal modules. These products will be replaced by InfraSen's innovative imagers in late 2024. Here are short specifications of mobile-enabled uncooled thermal modules:
☛ Resolution : 384x288 and 640x480
☛ Pixel pitch: 17 µm
☛ Wavelength range: 8 - 12 µm
☛ NETD: < 80 mK
☛ Frame rate: 30 Hz
☛ Video out: MIPI-CSI-2
☛ Communication: I2C
☛ Lens: With or Without
Contact us for a quote sales@infrasen.vn
InfraSen's thermal imagers
InfraSen's designed subVGA resolution imagers
InfraSen's designed 2K resolution imagers
To be shipped in late 2024.
Contact us for accelerating the shipment investors@infrasen.vn